Researchers have demonstrated a silicon-polymer hybrid modulator that can efficiently and reliably transmit data at 200 Gbit/s over an extremely wide range of temperatures from 25 °C to 110 °C. Use of such robust modulators in high-speed data applications could reduce cooling demands of the systems and expand applications in harsh environments.
from Top Technology News -- ScienceDaily https://ift.tt/35slUEW
from Top Technology News -- ScienceDaily https://ift.tt/35slUEW
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